Determining the Effect of Fine Mesh Solder Powder on Flux Residue RemovalAuthors: Timothy O’Neill, Terry Munson, Kalyan Nukala, M.S.Ch.E. and Ravi Parthasarathy, M.S.Ch.E.
Company: AIM, Foresite and ZESTRON Americas
Date Published: 10/14/2018 Conference: SMTA International
At APEX 2018, a study titled ‘Jet Printed Solder Paste and Cleaning Challenges’ was presented whereby data was presented indicating that as solder powder becomes finer, the resulting flux residues become more difficult to remove. As a continuation of the APEX 2018 study, this study will test a common No-Clean flux chemistry with progressively finer SAC305 solder powders with a variety of cleaning chemistries and methods to attempt to quantify the implications of finer mesh powder on flux removal. This study was divided into two phases. For Phase 1, a fully populated ZESTRON test vehicle was assembled and cleaned. Post washed cleanliness levels on the surface as well as under-component were measured using visual inspection. Based on this analysis, Phase 2 trials were conducted utilizing the IPC-B-52 test vehicle cleaning agents yielding best and worst cleaning results from Phase 1. In this phase, cleanliness assessment was conducted using SIR and Ion Chromatography analyses. The results were analyzed to assess the influence of finer solder powder paste deposits on the cleaning process and materials. All cleanliness assessments were conducted in accordance with current IPC guidelines.
Jetting Paste, Cleaning No-Clean, PCB Cleaning, SIR, Flux Residue Removal, Fine Pitch Solder Paste
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