SMTA International Conference Proceedings

Technology for Components with a High Position Accuracy

Authors: Jörg Trodler, Dipl.-Ing., Dr. Ing. habil. Heinz Wohlrabe, Oliver Albrecht, Stefan Gunst, Dr. Ing.; Jürgen Ehmes; Stefan Merlau and James Wertin
Company: Heraeus Deutschland GmbH&Co.KG, Technical University Dresden, Germany, Heraeus Deutschland GmbH&Co.KG and Heraeus Electronics
Date Published: 10/14/2018   Conference: SMTA International

Abstract: Devices containing special components such as LEDs, connectors, radar sensors, etc., require a high degree of alignment accuracy during the assembly process. Standard assembly methods using solder paste experience movements, regardless of the placement position, caused by the surface tension of an alloy while in the molten phase. Typical assembly methods utilizing conductive adhesives have been excluded due to the lack of thermal conductivity. Sintering is another option but can be cost prohibitive.

This paper will describe two application options, accommodating the assembly of these critical devices while eliminating the concern of movement during reflow. The first comes in the form of a solder paste, which eliminates the self-aligning effect inherent to typical alloys during reflow. The second, a product containing a combination of solder paste and SMT-adhesive, which provides complete solder joints without defects such as solder beads or high-level voids.

Key Words: 

Soldering, Surface Tension and selfcentering, Pick and Place, Accuracy, SMT-adhesive.

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