Technology for Components with a High Position AccuracyAuthors: Jörg Trodler, Dipl.-Ing., Dr. Ing. habil. Heinz Wohlrabe, Oliver Albrecht, Stefan Gunst, Dr. Ing.; Jürgen Ehmes; Stefan Merlau and James Wertin
Company: Heraeus Deutschland GmbH&Co.KG, Technical University Dresden, Germany, Heraeus Deutschland GmbH&Co.KG and Heraeus Electronics
Date Published: 10/14/2018 Conference: SMTA International
This paper will describe two application options, accommodating the assembly of these critical devices while eliminating the concern of movement during reflow. The first comes in the form of a solder paste, which eliminates the self-aligning effect inherent to typical alloys during reflow. The second, a product containing a combination of solder paste and SMT-adhesive, which provides complete solder joints without defects such as solder beads or high-level voids.
Soldering, Surface Tension and selfcentering, Pick and Place, Accuracy, SMT-adhesive.
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