Qualitative Model Describing Hot Tear above VIPPO And Numerous Other Design ElementsAuthors: Günter Gera, Udo Welzel, Yin Jizhe, Harald Feufel
Company: Robert-Bosch GmbH
Date Published: 10/14/2018 Conference: SMTA International
In this paper, the general mechanism for the formation of Hot Tears will be discussed and applied to numerous other design elements that can be found on Printed Circuit Board Assemblies (PCBA). We will show that due to several industry trends e.g. VIPPO, heavy copper PCBs, buried vias, non-eutectic alloys, thinner components, thicker boards, via in pad, etc. the probability of Hot Tears is steadily increasing.
VIPPO, Hot Tear, Solder, Separation, Reflow Soldering, BGA, Fillet Lifting. ePad
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