Cavity Board SMT Assembly ChallengesAuthors: Dudi Amir and Brett Grossman
Company: Intel Corporation
Date Published: 10/14/2018 Conference: SMTA International
The intent of this study is to identify the challenges related to assembly of a package into a cavity on the board, and establish the best known method for SMT assembly success. The paper will examine a System-in-Package (SiP) BGA (ball grid array) package assembly into a cavity in a mother board. The paper will describe the challenges facing the PCB design and fabrication. It will share the SMT assembly method and the impact of different board suppliers, stencil technology and squeegee design. It will discuss the warpage of the PCB and its effect to SMT results. Finally, the paper will summarize the challenges and provide best known method to overcome them to have a successful assembly in a cavity board.
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