Impact of Stencil Quality & Technology on Solder Paste Printing Performance
Authors: Jeffrey Len Yung Kwuan, Leon Rao, Evan Yip, Wisdom Qu, Jonas Sjoberg Company: Indium Corporation of Asia Pacific Singapore Date Published: 10/14/2018
Abstract: The growth of the Internet of Things (IoT) has greatly increased miniaturization development in packaging and board level assembly. As the industry is moving to smaller and finer pitches such as 008004, 0.3mm CSP, and BGA, screen printing becomes one of the critical processes to produce a good quality surface mount assembly. It has been widely accepted that 50–70% of SMT defects come from printing applications. There are many variables that will affect the quality of printing such as machine set up, solder paste handling and storage, stencil quality, stencil aperture design, printing parameters, and others. In this paper, we will evaluate the impact of stencil quality statistically through MiniTab software by comparing the printing performance of 0.35mm pitch and 01005 pads from different stencil suppliers.
Internet of Things (IoT), miniaturization, printing performance, 0.35mm pitch, 01005 pad