Reflow Profiling for Next-Generation Solder AlloysAuthors: Meagan Sloan, Kim Flanagan, Brook Sandy-Smith and MB Allen
Company: Indium Corporation and KIC
Date Published: 10/14/2018 Conference: SMTA International
This paper will review common profile shapes and recipes, showing data for how they differ in the resulting solder joints. There will also be a discussion on the critical points of successful reflow profiling for the wider range of Pb-free alloys now on the market.
In addition, as high-temperature applications that traditionally used high-Pb alloys for high operating temperatures come close to losing RoHS exemptions, new alloys are emerging to achieve the high performance expectations associated with applications in this range.
high-reliability, SAC alloys, reflow profiling, reflow process window
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