NICKEL / PALLADIUM SURFACE FINISH FOR SEMICONDUCTOR PACKAGING APPLICATIONS
Authors: C. Fan, A. Blair and J. A. Abys Company: Lucent Technologies Date Published: 5/4/2000
Surface Finishes Forum
Abstract: To meet increasingly strengthened environmental and legislative requirements for lead-free finishes, the electronics industry has renewed interests in nickel / palladium plated leadframes in semiconductor packaging. Over the last few years, new surface finishing processes have been developed to improve the performance of leadframes in soldering, wirebonding and other packaging aspects. Meanwhile, the hesitation to convert traditional leadframe finishing processes (selective silver plating and post tin-lead plating) to nickel / palladium finishing has persisted in this cost-sensitive industry due to the inconsistency of palladium supply and price issues. In this paper we will introduce background information of the Pd PPF (palladium pre-plated frames) technology, review the new technical and economic developments in leadframe surface finishing and provide comments and discussion.