Surface Finishes Forum Conference Proceedings


NICKEL / PALLADIUM SURFACE FINISH FOR SEMICONDUCTOR PACKAGING APPLICATIONS

Authors: C. Fan, A. Blair and J. A. Abys
Company: Lucent Technologies
Date Published: 5/4/2000   Conference: Surface Finishes Forum


Abstract: To meet increasingly strengthened environmental and legislative requirements for lead-free finishes, the electronics industry has renewed interests in nickel / palladium plated leadframes in semiconductor packaging. Over the last few years, new surface finishing processes have been developed to improve the performance of leadframes in soldering, wirebonding and other packaging aspects. Meanwhile, the hesitation to convert traditional leadframe finishing processes (selective silver plating and post tin-lead plating) to nickel / palladium finishing has persisted in this cost-sensitive industry due to the inconsistency of palladium supply and price issues. In this paper we will introduce background information of the Pd PPF (palladium pre-plated frames) technology, review the new technical and economic developments in leadframe surface finishing and provide comments and discussion.

Keywords: Nickel/Palladium Surface Finish, Semiconductor Packaging, Leadframe, Solderability, Wirebonding



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