Combing Automated Advanced Process Control with Feedback to Revolutionize the Printed Circuit Board Assembly ProcessAuthors: Jenny Yuh, Joseph Park, Denis Kang and Brent Fischthal
Company: Koh Young Technology, Inc.
Date Published: 10/14/2018 Conference: SMTA International
Guided in part by Industry 4.0, these M2M communication standards are quickly altering the manufacturing process by improving metrics like first pass yield and throughput by applying autonomous process adjustments. Far beyond an automatic line changeover, this bi-directional communication allows equipment to automatically adjust production parameters to increase board quality and lower costs by eliminating rework and scrap.
Building on our expertise and testing, this presentation will explore Industry 4.0, and then explore how Advanced Process Control (APC) can increase production yields and reduce defects. Specifically, the presentation will discuss how APC improves process repeatability by automatically adjusting component placement to the paste, rather than to the pad location. Moreover, it will show how APC will identify a shift trend and implement further position correction by using true 3D measurement data from the Automatic Optical Inspection (AOI) system. While a smart factory will help resolve the skilled employee challenge, it will also revolutionize process optimization.
3D Measurement, Automatic Optical Inspection AOI, Artificial Intelligence AI, Advanced Process Control APC
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