SMTA International Conference Proceedings


How X-Ray Technology is Improving the Electronics Assembly Process

Authors: Griffin Lemaster and Bill Cardoso, Ph.D.
Company: Creative Electron, Inc.
Date Published: 10/14/2018   Conference: SMTA International


Abstract: It was 1895 when Wilhelm Roentgen discovered a mysterious light that allowed him to see through things – and called it x-rays. Since then, x-rays have been adopted in a wide range of applications in the electronics assembly process. Instead of taking a “deep-dive” in one aspect of x-ray inspection, in this paper we’ll cover a broad range of applications:

- Electronic component inspection. - Real-time defect verification. - Counterfeit detection. - Component counting and material management. - Reverse engineering. - 2D, 2.5D, and 3D x-ray inspection. - Voids, bridging, and head-in-pillow failures in bottom terminated components - Design for manufacturing (DFM) and design for x-ray inspection (DFXI). - Artificial Intelligence

We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way in which we manufacture and inspect anything.

Key Words: 

X-ray, Radiography, NDT, Counterfeit Detection, Reverse Engineering, DFM, DFXI, Artificial Intelligence



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