How X-Ray Technology is Improving the Electronics Assembly ProcessAuthors: Griffin Lemaster and Bill Cardoso, Ph.D.
Company: Creative Electron, Inc.
Date Published: 10/14/2018 Conference: SMTA International
- Electronic component inspection. - Real-time defect verification. - Counterfeit detection. - Component counting and material management. - Reverse engineering. - 2D, 2.5D, and 3D x-ray inspection. - Voids, bridging, and head-in-pillow failures in bottom terminated components - Design for manufacturing (DFM) and design for x-ray inspection (DFXI). - Artificial Intelligence
We will also discuss how artificial intelligence (AI) is changing the way we think about x-ray inspection. Things we would never dream of doing just a few years ago are now reality by combining AI and x-ray inspection. Moreover, we will show you a series of real-life cases on how our team of AI scientists is using AI to solve the most challenging applications in x-ray inspection. And beyond x-ray inspection, we’ll examine how AI is forever changing the way in which we manufacture and inspect anything.
X-ray, Radiography, NDT, Counterfeit Detection, Reverse Engineering, DFM, DFXI, Artificial Intelligence
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