IWLPC (Wafer-Level Packaging) Conference Proceedings

The Road to Wafer-On-Wafer (Wow) High Volume Manufacturing (HVM)-Advanced Sensing in Wafer Handling

Author: Boris Kesil
Company: Quartet Mechanics, Inc.
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)

Abstract: 3D integration of functions such as sensors enables miniaturized and cost-effective smart systems. This paper reviews how the sensors consequently enable smart volume manufacturing of 3D IC such as Wafer-On-Wafer (WOW), where process wafers can be fragile and difficult to transfer safely. Multi-disciplinary sensing technology will be introduced for wafer handling and in-line inspection before or during the wafer's process steps.

Key Words: 

3D IC, Wafer-On-Wafer, IRT, sensor, optical, Impedance, Resonance, measurement, thin wafer, wafer handling, noncontact handling, wafer bonding, TSV, CMP, thin film measurement, on-the-fly wafer inspection

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