Temporary Bonding and the Challenge of Cleaning Post-DebondAuthors: Phillip Tyler, Kenji Nulman, Laura Mauer, Michelle Fowler and Seth Molenhour
Company: Veeco Instruments and Brewer Science, Inc.
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
Optimized cleaning is a result of selecting the most effective chemistry, equipment and process. The chemistry should dissolve the temporary bonding material while leaving the device wafer undamaged. The equipment needs to maintain process parameters such as temperature and flow rates while recirculating the chemical for reduced chemical consumption. The process determines the optimized parameters and sequence for the most effective cleaning at the lowest cost of ownership.
This paper describes the methodology and experimentation done to optimize the cleaning process for BrewerBOND® 305 bonding material. Parameters addressed included chemical purity, bath life and consumption, process temperature, dispense method, time and process sequence. A design of experiment (DOE) methodology was performed to determine the impact of tool and chemical parameters to yielding residue-free wafers. In addition, the effect of adhesive film thickness on process conditions was considered. Processes will be presented for both debonded wafers and wafers mounted onto film frames. The methodology provided an optimized cleaning process with lower cost using recirculated chemistry at ambient temperature.
wafer cleaning, temporary bonding, mechanical debonding, laser debonding
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