IWLPC (Wafer-Level Packaging) Conference Proceedings

Redistribution-Layers (RDLS) for Fan-Out Panel-Level Packaging

Author: John H Lau
Company: ASM Pacific Technology, Inc.
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)

Abstract: In this study, the fabrication of RDLs for fan-out panel-level packaging (FOPLP) is presented. Emphasis is placed on different methods in making the RDLs for FOPLP. Some recommendations are also provided. Finally, the critical issues of FOPLP are presented.

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