Fabrication of Redistribution Structure Using Highly Reliable Photosensitive Polyimide for Fan Out Panel Level PackagesAuthors: Hitoshi Araki, Yu Shoji, Yuki Masuda, Keika Hashimoto, Kazuyuki Matsumura, Yutaro Koyama, and Masao Tomikawa
Company: Electronic & Imaging Materials Research Laboratories, Toray Industries, Inc.
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
We also successfully developed redistribution structure by using the above posi-PSPI and all wet Cu plating processes. To obtain the structure, patterned Cu was obtained by non-electrical plating on photosensitive polyimide layer with a mask of photo-resist. We coated the posi-PSPI by a slit coater and found a suitable wet surface treatment to obtain good adhesion to plated Cu. The all wet Cu processes are composed of wet activation process and electro-Cu plating process. By combining all these processes, 40µm line and space Cu pattern was obtained by using a 500-600mm glass panel. In addition 2µm line and space Cu pattern was obtained on a 8 inch glass wafer.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.