Recent Developments in Panel Level PackagingAuthors: Tanja Braun, Mathilde Billaud, Hannes Zedel, Lutz Stobbe, Karl-Friedrich Becker, Ole Hoelck, Markus Wöhrmann, Lars Boettcher, Michael Töpper, R. Aschenbrenner, Steve Voges, Klaus-Dieter Lang, Martin Schneider-Ramelow
Company: Fraunhofer Institute for Reliability and Microintegration; Technical University Berlin, Microperipheric Center
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
The paper will describe recent developments along the process chain including materials for carrier selection, encapsulation and redistribution layer as well as the related process and equipment options. Especially the redistribution layer (RDL) application offers a variety of technology options. In addition, main challenges as warpage, die shift and panel handling in PLP will be discussed.
However, for industrialization also the understanding of the cost structure and cost opportunities are important – also referring to the different technology options. Therefore, a highly granular cost model is introduced and application scenarios are presented.
Panel Level Packaging, die shift, warpage, cost modelling, cost analysis
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