Significant Advancement in Laser Ablative Release Layer Material Design Enabling Low-Energy and Low-Residue DebondAuthors: Luke Prenger, Qi Wu, Arthur Southard, Debbie Blumenshine, Rama Puligadda
Company: Brewer Science, Inc.
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
The research within this study addresses all of the aforementioned challenges and includes the developmental results of a next generation of laser release materials showing significant advancements to overcome challenges. Next-generation materials have greatly improved performance with increased absorbance of laser energy at 308-nm, 343-nm, and 355-nm wavelengths. This allows materials to debond with lower energy, protect the device from laser energy, produce almost no carbon residue upon ablation, and greatly reduce cleaning time because these materials offer all of this utilizing a thinner coat. This next generation of laser release materials brings an additional benefit of strong open-face solvent resistance without requiring long, high-temperature bakes or compromising the decomposition temperature of the material.
Laser Release Material, Temporary Wafer Bonding, Low Energy, Low Carbon Residue
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