Thermal Debonding and Warpage Adjust of FOWLP - A Crucial Step in the Evolution of Advanced Packaging?Authors: Sophia Oldeide, Regine Beckmann, Laurent Giai-Miniet, Klemens Reitinger
Company: ERS Electronic GmbH
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
This paper presents the influences of thermal debonding and associated process steps to the quality of the reconstituted wafer or panel. Details of the process steps "debonding", "detaping" and "warpage adjust" are explained. It will also describe how to deal with the two biggest issues; die shift and warpage, and how to integrate these solutions into a HVM (High Volume Manufacturing) capable machine.
Fan-Out Wafer Level Packaging, Panel Level Packaging, Debonding, Warpage
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