IWLPC (Wafer-Level Packaging) Conference Proceedings


Thermal Debonding and Warpage Adjust of FOWLP - A Crucial Step in the Evolution of Advanced Packaging?

Authors: Sophia Oldeide, Regine Beckmann, Laurent Giai-Miniet, Klemens Reitinger
Company: ERS Electronic GmbH
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Fan-out technology has gained a lot of traction in the advanced packaging area for the last several years. It has been a hot topic of attention as it provides several advantages as compared to conventional CSP (Chip Scale Package) package. It allows higher I/O counts with a small package footprint, and good electrical properties and performance. The chips are embedded in a mold with the I/O fanning in and out over the mold surface using polymer and metal to build up RDL (redistribution layers). The starting point of this process is a so-called "reconstituted wafer". This wafer is created by placing KGD (Known Good Die) on a temporary carrier, then over-mold them in a compression molding machine and finally debond the created wafer from the temporary carrier. Debonding with a thermal release agent is a convenient, fast and clean method to release the reconstituted wafer from the carrier.

This paper presents the influences of thermal debonding and associated process steps to the quality of the reconstituted wafer or panel. Details of the process steps "debonding", "detaping" and "warpage adjust" are explained. It will also describe how to deal with the two biggest issues; die shift and warpage, and how to integrate these solutions into a HVM (High Volume Manufacturing) capable machine.

Key Words: 

Fan-Out Wafer Level Packaging, Panel Level Packaging, Debonding, Warpage



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