Enabling Reliability of 3D TSV Advanced Packages with Non-Conductive, Pre-Applied Underfill Film MaterialsAuthors: Jie Bai, Kail Shim, James Jang, Kevin Lindsey, Haiying Li, Qizhuo Zhuo, Rose Guino, and Ramachandran K. Trichur
Company: Henkel Corporation
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
In this paper, the latest-generation of NCF materials and corresponding film lamination, base tape removal, die singulation, and thermal compression bonding process will be discussed. The new NCF formulation provides rapid curing kinetics to enable shorter bonding times and, therefore, higher UPH by delivering a three-second bonding profile, as well as feasibility for a two-second bonding profile. Combined with the embedded flux system and flow properties optimization, curing kinetics optimization, the novel NCF material achieves proper solder joint formation, no material entrapment, and void-free filling. Bonding force study of this NCF material was carried out on a die to substrate test vehicle to find out the optimal bonding force. And the reliability testing results will also be discussed. Based on the study outcomes, the new NCF material is expected to show excellent performance for thermal compression bonding for 3D chip-stacking applications.
3D TSV, chip-stacking, NCF, thin die, UPH
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