IWLPC (Wafer-Level Packaging) Conference Proceedings


Reducing the Cost of Applying Ultra-Thin, Package Level EMI Shield Coatings

Author: Stuart Erickson
Company: Stuart Erickson Ultrasonic Systems, Inc.
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)


Abstract: As highly sensitive circuit assembly components become more tightly packed, demand for cost-effective package-level EMI (electromagnetic interference) shielding increases. The process cost for applying a thin (less than 10µm) conductive metal EMI shielding layer to individual packages is substantial when traditional sputtering and plating methods are used.

A new technology offers a way to apply sprayable coatings that provide highly-effective EMI shielding performance. T-CAT (ultra-Thin Coating Application Technology) is a proven application method that applies a uniform, ultra-thin layer, while reducing the process cost by up to 60%.



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