Reducing Spatter in Flux Cored Solder Wires for Robotic Soldering ApplicationsAuthors: Arturo Espejo, Olga Spaldon-Stewart, Geoffrey Post and Kyle Loomis
Date Published: 10/14/2018 Conference: SMTA International
Mitigating solder ball spatter is one of the most critical requirements, as advanced robotic soldering applications cannot tolerate the associated reliability concerns. Solder ball spatter of greater than 200?m can potentially cause bridging of fine pitch devices. A Design of Experiments (DOE) structure was used to optimize numerous process variables, which, along with flux optimization, translates into maximized reliability performance in customer applications.
robotic, soldering, rework, spatter, cored wire, spitting, solder ball, DOE
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