Fine RDL Formation Using Alternative Patterning Solution for Advanced PackagingAuthor: Habib Hichri; Markus Arendt; Richard Hollman; Ognian Dimov; Sanjay Malik
Company: SUSS Microtec Photonic Systems Inc, ASM NEXX Inc, Fujifilm Electronic Materials
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
An innovative fabrication process has been developed for RDL and via formation using excimer laser ablation of an optimized dielectric material for each layer. Metallization is a key factor in making this process practical and cost effective. Yield and reliability is dependent on the adhesion between seed layer and dielectric film. Precise and optimized bottom-up plating is required to eliminate the need for a chemical mechanical planarization (CMP) process.
This paper presents a novel excimer laser enabled dual damascene process for ultra-fine routing for BEOL. Fine RDL down to 2/2µm L/S and vias down to 5µm diameter are patterned using an excimer laser stepper with a reticle mask. We will report progress in demonstrating fabrication and technical characterization of this new embedded trace approach with and without planarization by CMP or fly-cutting methods. Capabilities and limitations of this bottom-up plating process will be discussed, its technical robustness and commercial advantages are demonstrated, and topics for further optimization are highlighted.
Laser ablation, embedded RDL, Dual Damascene, bottom up plating
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