IWLPC (Wafer-Level Packaging) Conference Proceedings

Antenna Integration Technologies for 5G Car-Application

Authors: Fabian Hopsch, Andy Heinig
Company: Fraunhofer Institute for Integrated Circuits IIS
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)

Abstract: The internet-of-things trend requires further progress in wireless transmission. The next generation of cellular mobile communications, the so called 5G, is on the way. The standards are defined and companies are working on first products. This 5G standard is required for an all-connected world in a wireless sense. It brings the capable performance with the necessary reduction of current consumption in relation to transmitted data. Furthermore real time transmission will enable new technologies like demanded for autonomous driving.

The impact of 5G devices could be immense. But it will also require, that the devices are very tiny and are very low power to be suitable to connect billions of devices. In recent times a lot of progress was made in the packaging technology, which could be a main driver behind 5G.

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