Antenna Integration Technologies for 5G Car-ApplicationAuthors: Fabian Hopsch, Andy Heinig
Company: Fraunhofer Institute for Integrated Circuits IIS
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
The impact of 5G devices could be immense. But it will also require, that the devices are very tiny and are very low power to be suitable to connect billions of devices. In recent times a lot of progress was made in the packaging technology, which could be a main driver behind 5G.
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