SMTA International Conference Proceedings


Effect of Component Density on Sn-3.0Ag-0.5Cu Solder Joint Reliability Under Harsh Environment

Authors: Won Sik Hong, Ph.D., Jinju Yu, BA., and Chulmin Oh, Ph.D.
Company: Korea Electronics Technology Institute
Date Published: 10/14/2018   Conference: SMTA International


Abstract: Due to End-of-Life Vehicle (EVL) banning, automotive electronics and its manufacturing system was exchanged, and also heavy construction equipment is demanded to use lead free electronics. Thus, in this study, degradation behavior of lead free solder joint was quantitatively compared with mounted position and component density of vehicle engine control unit (VECU) for excavator. Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder and FR-4 PCB plated with electroless nickel immersion gold (ENIG) were used. Thermal shock test was performed at -40-125 ?, 10 min dwell at each temperature for 1500 cycles. We obtained that shear strength degradation of high component density area was larger than that of small component density. Based on this result, we have known that it was important to consider the component density for uniform heat distribution at electric circuit design under harsh environment.

Key Words: 

Component density, Thermal cycling, Pb-free, Solder joint, Degradation, Automotive electronics



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