SMTA International Conference Proceedings

Developing High Reliability Solders for Harsh Environment

Authors: Mehran Maalekian, Ph.D.
Company: AIM Solder
Date Published: 10/14/2018   Conference: SMTA International

Abstract: Applications such as high power LED lighting and under hood automotive require a solder alloy to operate at temperatures higher than 150 °C where common leaded and lead-free alloys would be prone to failure. In order to develop a suitable solder alloy for harsh environment we need to understand the role of each alloying element added into the solder alloy and identify to what extend can benefit a solder joint from metallurgical and reliability point of view. Therefore, in this work a systematic study on the effects of Bi, Sb, Ag, Cu and Ni on mechanical and thermal behavior of Sn-based alloys is presented. Based on this systematic approach and other research presented earlier a new multicomponent solder alloy for demanding applications is presented. In this metallurgical approach, the evolution of microstructure and mechanical properties with alloying elements and thermal effects are emphasized as the key parameters when developing solder alloys for demanding applications.

Key Words: 

Lead-free solder, high reliability, electronic assembly, mechanical properties

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