The Influence of Aspects of Solder Paste Formulation and Soldering Process Factors on Voiding Under Large Qfn DevicesAuthors: Matthew Jones, Tamara Goas-Fernandez and Barry Wenham
Date Published: 10/14/2018 Conference: SMTA International
A range of three solder pastes with different solvent systems were evaluated for voiding during multiple tests; these results were aggregated and show the effect of formulation and two process factors (profile and aperture design) on voiding. Following this, a general factorial experiment was used to more formally evaluate a similar range of pastes and process factors, also including three common board finishes.
Voiding, BTC, QFN, Solder Paste, Reflow, X-ray.
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