Thermomechanical Reliability of Low-Temperature Solder Alloys for Mid-Power Led PackagesAuthors: Niveditha Nagarajan, Matthew Siebenhuhner, Nicholas Herrick, Ranjit Pandher and Carl Bilgrien
Company: Alpha Assembly Solutions
Date Published: 10/14/2018 Conference: SMTA International
In this laboratory study, a statistically significant quantity of commercially available mid-power LED packages was assembled onto aluminum core and FR4 substrates using three SnBi alloys and SAC305, on standard SMT equipment (stencil printer and pick-n-place). Shear strength, junction temperature, luminous flux, efficiency and spectral emission were measured. The samples were put through thermal-cycling, for up to 2000 cycles to induce thermomechanical stress. Samples were then re-measured after every 500 cycles, to evaluate the level of degradation of the solder alloy. We will present the results of this study and discuss possible applications for the use of low temperature solder alloys in L2 LED assembly.
Low Temperature Solder, LED, thermomechanical reliability
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