SMTA International Conference Proceedings


Investigation of Copper Sinter Material for Die Attach

Authors: Christian Schwarzer, Ly May Chew, Michael Schnepf, Thomas Stoll, Jörg Franke and Michael Kaloudis
Company: UAS Aschaffenburg Heraeus Deutschland GmbH & Co.KG and Friedrich-Alexander-University FAPS
Date Published: 10/14/2018   Conference: SMTA International


Abstract: Die attach on power semiconductor using lead-free technology has attracted considerable interest. Silver sintering has been considered as one of the most promising lead-free die attach solutions over the past years. Pressure silver sintering by far offers superior thermal and electrical conductivity properties which enables power electronics applications to operate at higher temperature. Although silver sintering is a promising technology, the high cost of silver increases the manufacturing cost and consequently impedes the wide adoption of this technology.

Copper is commonly used in the electronics industry mainly due to its unique properties such as good thermal and electrical conductivity. Hence, it is not surprising that recently there are several academic and industrial researches using copper as an alternative die attach material for sintering process. Nevertheless, copper sintering is usually requires an additional reducing process using hazardous gases such as hydrogen and formic acid to prevent copper oxidation as well as to increase the bonding strength.

In this study, we develop a safe-to-use micro-copper sinter paste for pressure sintering under inert atmosphere.

Key Words: 

copper sintering, die attach material, power electronics



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