Investigation of Copper Sinter Material for Die AttachAuthors: Christian Schwarzer, Ly May Chew, Michael Schnepf, Thomas Stoll, Jörg Franke and Michael Kaloudis
Company: UAS Aschaffenburg Heraeus Deutschland GmbH & Co.KG and Friedrich-Alexander-University FAPS
Date Published: 10/14/2018 Conference: SMTA International
Copper is commonly used in the electronics industry mainly due to its unique properties such as good thermal and electrical conductivity. Hence, it is not surprising that recently there are several academic and industrial researches using copper as an alternative die attach material for sintering process. Nevertheless, copper sintering is usually requires an additional reducing process using hazardous gases such as hydrogen and formic acid to prevent copper oxidation as well as to increase the bonding strength.
In this study, we develop a safe-to-use micro-copper sinter paste for pressure sintering under inert atmosphere.
copper sintering, die attach material, power electronics
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