New Interconnection for High Temperature Application: HotPowCon (HPC)
Authors: Steffen Käss, Ph.D., Sebastian Fritzsche, Ph.D., Wolfgang Schmitt, Dipl. Ing., Jörg Trodler, Dipl. Ing., Daniel Feil, Timo Herberholz, Ph.D. Company: Heraeus Deutschland GmbH and Robert Bosch GmbH Date Published: 10/14/2018
Abstract: An innovative interconnection technology developed in the public funded project ‘HotPowCon’  is capable for resistant joints for SMT components, bigger dies, like MOSFETs or IGBTs and even large area substrates, like baseplate or heat sinks. The presentation showed that the combination of Cu Sn based alloys and Cu powder can increase the melting temperature to over 400 °C by creating intermetallic connections with technologies known from standard SMT reflow soldering. The CuSn intermetallic is grown by a two-paste system wherein the liquid solder paste infiltrates in a dried copper paste. By adjusting the copper particle distribution the presented diffusion soldering process can be used to produce currently large area contact of up to 1000 mm2. First results from power cycling investigations show a significant increase of lifetime compared to a SnAgCu305 solder paste. In addition several mechanical properties of the HotPowCon material were investigated. This allows to design future high temperature stable applications with a significant increase of robustness.
diffusion soldering, HotPowCon, intermetallic compounds, temperature resistive solder joint, large area contact, CuSn