Authors: Dian Wang, Fazhi An and Seung Wook Yoon Company: Calterah Semiconductor Technology (Shanghai) Co. and STATS ChipPAC Pte Ltd. JCET Group Date Published: 10/23/2018
IWLPC (Wafer-Level Packaging)
Abstract: FOWLP (Fan-Out Wafer Level Packaging) has been established as one of the most versatile packaging technologies in the recent past and already accounts for a market value of over 1 billion USD due to its unique advantages. The technology combines high performance, increased functionality with a high potential for heterogeneous integration and reduces the total form factor all in a cost-effectiveness format. FOWLP volumes have largely been driven by mobile and consumer applications (RF, BB, connectivity, NFC, PMIC, audio codec, MCU etc) and are now moving to 5G communication, mmWave, automotive, MEMS/Sensor and IoT/WE applications. Advanced embedded Wafer Level Ball Grid Array (eWLB) provides a versatile platform for the semiconductor industry’s technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations. WLP (wafer level packaging) has already been adopted in the automotive market for cabin or infotainment applications as well as 77GHz radar sensors utilizing FO-WLP.
This study focuses on the development of eWLB for mmWave applications above 60GHz with CMOS IC technology. Additionally the case study of 77GHz ADAS automotive radar is discussed. Package design optimization of single-die and multi-die, electrical performance characterization and component level reliability tests are presented.