High Speed 3D Inspection of Advanced Package Interconnect UniformityAuthors: Zonghu He Ph.D. and John Schaefer B.E.E.
Company: Rudolph Technologies, Inc.
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
A new generation laser triangulation (LT) 3D inspection sensor was developed to address these needs. The high resolution is achieved by using a laser line projector positioned 45 degrees from the wafer normal to generate a very narrow line of light on the wafer. The line is viewed with a proprietary, custom-designed, state-of-the-art CMOS camera and high-end microscope optics. Distance to over 1,000 points along the line is measured for each camera frame. Inspection rates three to five times faster than the previous technology can be achieved with improved accuracy and repeatability.
Tests show that a 300mm wafer with 16 million pillar bumps can be inspected in as little as three minutes at resolutions appropriate to achieve 0.15µm 3sigma height repeatability. Bump heights ranging from 2µm to 350µm can be measured in a single pass. This technology enables precise measurement performance and excellent throughput, making it ideal for today's high-volume production environment.
3D inspection, micro-bump, bump height, bump coplanarity, copper pillar, laser triangulation
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