A Practical Guide for First-Time FOWLP Design SuccessAuthors: Kevin Rinebold, John Ferguson, Keith Felton
Company: Mentor, A Siemens Business
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
Implementing a unified FOWLP design approach requires a significant expansion in communication between the IC design world, the package design world, and a new dimension, that of communication and interaction with the OSAT/Foundry that will fabricate and assemble the complete device. FOWLP, as with other emerging High Density Advanced Packages (HDAP), have unique and often restrictive/strict rules and guidelines, a hybrid combination of traditional ASIC and organic packaging worlds.
This paper will explore best-practice approaches for embarking on FOWLP design, including how to leverage your Foundry or Outsourced Substrate Assembly and Test (OSAT) partner, and how to ensure your design is manufacturable the first time to avoid expensive and time-consuming changes.
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