IWLPC (Wafer-Level Packaging) Conference Proceedings

An Innovative Application of Fan-Out Packaging for Test & Measurement-Grade Products

Author: Barrett Poe
Company: Keysight Technologies
Date Published: 10/23/2018   Conference: IWLPC (Wafer-Level Packaging)

Abstract: Keysight Technologies has partnered with a fan out packaging vendor to take advantages of wafer level packaging (WLP) packaging for its custom ASICs. The Packaging and System Integration group in the Keysight Laboratories ASIC Technology organization reports on the application of WLP technology in Keysight Test & Measurement products, discusses its suitability for RF applications in general, and shares design and characterization results for a new 33 GHz oscilloscope front-end architecture – which has been implemented in a fully surface-mount assembly.

WLP semiconductor packaging was primarily developed to meet the challenging cost and form factor demands of mobile consumer products. It has seen rapid adoption in recent years for those applications, however, attributes such as low interconnect parasitics, flexible signal routing, arbitrary Ball Grid Array (BGA) configuration, and excellent thermal dissipation also result in an attractive solution for RF applications. Historically, high-frequency packaging solutions have relied heavily on chip & wire hybrid technologies, which tend to be expensive and bulky. Adoption of WLP technology compliments Keysight’s cutting edge test and measurement equipment and was a critical enabler in achieving the unprecedented cost/performance of the new 13 – 33 GHz Infiniium UXR Series Oscilloscopes.

This paper discusses techniques leveraged by the WLP packaging to reduce cost and form factor, optimize signal integrity, and improve thermal performance. Measurement results and diagrams are shared illustrating how the signal path and grounding structure improves using the WLP construction, and the paper describes how a 33 GHz bandwidth is achieved at a significantly lower cost than alternative solutions.

Key Words: 

Wafer Level Packaging, Keysight, Oscilloscope, Test and Measurement

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