An Innovative Application of Fan-Out Packaging for Test & Measurement-Grade ProductsAuthor: Barrett Poe
Company: Keysight Technologies
Date Published: 10/23/2018 Conference: IWLPC (Wafer-Level Packaging)
WLP semiconductor packaging was primarily developed to meet the challenging cost and form factor demands of mobile consumer products. It has seen rapid adoption in recent years for those applications, however, attributes such as low interconnect parasitics, flexible signal routing, arbitrary Ball Grid Array (BGA) configuration, and excellent thermal dissipation also result in an attractive solution for RF applications. Historically, high-frequency packaging solutions have relied heavily on chip & wire hybrid technologies, which tend to be expensive and bulky. Adoption of WLP technology compliments Keysight’s cutting edge test and measurement equipment and was a critical enabler in achieving the unprecedented cost/performance of the new 13 – 33 GHz Infiniium UXR Series Oscilloscopes.
This paper discusses techniques leveraged by the WLP packaging to reduce cost and form factor, optimize signal integrity, and improve thermal performance. Measurement results and diagrams are shared illustrating how the signal path and grounding structure improves using the WLP construction, and the paper describes how a 33 GHz bandwidth is achieved at a significantly lower cost than alternative solutions.
Wafer Level Packaging, Keysight, Oscilloscope, Test and Measurement
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