Cleaning Agent Innovation for Highly Dense Electronic Assemblies
Author: Mike Bixenman Company: Kyzen Corporation Date Published: 4/25/2017
Abstract: Cleaning electronic hardware is well known. The challenges with cleaning highly dense hardware are many. Low standoff gaps prevent flux outgassing and can underfill the bottom termination with active flux residue. Mixed metals can react with alkaline cleaning agents, which can result in metal attack, discoloration and galvanic corrosion. Low foaming under pressure is needed to allow for time and mechanical energy to reach the residue and remove contamination under the components. The purpose of this research is to present aqueous cleaning technology innovations to address the challenges of cleaning highly dense electronic hardware. Material compatibility on mixed metals, cleaning performance and bath life studies will be presented.