Impact on Water Cooled Heatsink Design from SMT Component Movement during Reflow
Author: Joe Fuller Company: Intel Corp Date Published: 2/5/2018
Pan Pacific Symposium
Abstract: The move from air cooled to water cooled heatsinks (without any airflow) for product segments like high performance computing means that many more board components must be in contact with the heatsink. At the same time, higher power across the board is driving tighter mechanical Keep Out Zones (KOZ) between the heatsink and components. These factors have combined to drive the requirement to understand final component location and tolerances of many more components. Understanding which components may end up shifted from their nominal position after reflow and allowing for that movement has become a critical element in the design of fully water cooled heatsinks.