Pan Pacific Symposium Conference Proceedings


Impact on Water Cooled Heatsink Design from SMT Component Movement during Reflow

Author: Joe Fuller
Company: Intel Corp
Date Published: 2/5/2018   Conference: Pan Pacific Symposium


Abstract: The move from air cooled to water cooled heatsinks (without any airflow) for product segments like high performance computing means that many more board components must be in contact with the heatsink. At the same time, higher power across the board is driving tighter mechanical Keep Out Zones (KOZ) between the heatsink and components. These factors have combined to drive the requirement to understand final component location and tolerances of many more components. Understanding which components may end up shifted from their nominal position after reflow and allowing for that movement has become a critical element in the design of fully water cooled heatsinks.

Key Words: 

Water Cooled Heatsink SMT Component Shift



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