Pan Pacific Symposium Conference Proceedings


The Latest Material Technologies for System in Package

Author: Osamu Suzuki
Company: NAMICS Corporation
Date Published: 2/5/2018   Conference: Pan Pacific Symposium


Abstract: Different types of devices are going to be more closely integrated with Advanced SiP. More delicate optimization of the material will be required. For Fan-out wafer level package (FO-WLP) application, epoxy molding compound (EMC) is introduced which is optimized modulus to address bowing issue of FO-WLP. The thermal properties of EMC with various resin structures were measured. Low warpage characteristics are demonstrated by low modulus EMC. For Power electronics application, we introduce a newly developed silver sintering die attach material incorporating soft-modifier. The impact of soft-modifier is also reported. Thermal stress management technique of materials is described for FO-WLP and Power electronics in this paper. This will be a more necessary material for SiP design.

Key Words: 

FO-WLP, EMC, epoxy, thermal stress, die attach



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