Pan Pacific Symposium Conference Proceedings

Enabling Information Age through Advanced Packaging Technologies and Electronic Materials

Author: Rozalia Beica
Company: The Dow Chemical Company
Date Published: 2/5/2018   Conference: Pan Pacific Symposium

Abstract: Computing has significantly evolved over the years; it has driven the semiconductor industry to develop advanced technologies and address the increasing needs and complexities across many generation of electronics, leading to today’s information age products. The introduction of smartphones, mobility and connectivity technologies, have extended the application space and raised the importance of innovation across the supply chain, from design to manufacturing, from front to mid and back end processes. The next generation of smart devices will continue to drive the need for higher performance, miniaturization and a greater demand for increased functionality. Innovation in materials and integration technologies will continue to play an important role in developing and bringing to production new devices and systems. This paper will give a broad overview of the semiconductor industry and advanced packaging evolution, highlighting the major developments and the critical role that innovation in electronic materials has in successfully bringing to the market new generations of smart devices.

Key Words: 

Connectivity, IoT, Advanced Packaging, Heterogeneous Integration, System in Package, Wafer Level Packaging, 3D Integration, Metallization, Interconnects

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