SMTA China Conference Proceedings

Failure Analysis Methods Research and Quality Control on Nickel Corrosion of ENIG Solder Joints

Authors: Shenzhen Kaifa Technology Co., LTD
Company: CongMei, JiaHua Zheng, HaiYan Xie, LuLiu, James Zhang
Date Published: 8/28/2017   Conference: SMTA China

Abstract: Based on the principle of the ENIG (Electroless Nickel / Immersion Gold) process and the mechanism of solder joint formation on ENIG finishing PCB, this paper propose effective analysis methods for the quality and reliability issues of ENIG solder joints which caused by nickel corrosion. The analysis result show that nickel corrosion causes too thin or discontinuous IMC (Intermetallic Compound) on the soldering interfaces. It will lead to insufficient soldering strength and reduce the reliability of the solder joints. ‘Mud-cracks’ and ‘Spike’ in the nickel plating is the reference for evaluating the nickel corrosion. To improve the quality and reliability of solder joints, this paper also gives the suggestions for nickel corrosion evaluation and control.

Key Words: 

ENIG process, Nickel corrosion, Failure analysis, IMC, Solder Joint reliability

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