The Study of Cure Percentage Determination for Anisotropic Conductive Film by FTIR MethodAuthors: Henley Zhou, Ivan Lin, Xin Ling, Jumbo Huang, Arnel Camacho, Ranilo Aranda, Jinsuo Guo, RSivam VRajoo, and Mike Doiron
Date Published: 8/28/2017 Conference: SMTA China
One of the widely used method for curing behavior analysis specially for raw adhesive material is the Differential Scanning Calorimetry (DSC) because of its experimental convenience and speed of operation. But this method cannot be used to determine the cure percentage of the ACF once it was assembled because it is impossible to get enough sample weight (normally more than 3 mg) for analysis. Another way to indirectly identify the cure percentage is by peel test. This method will give a result by identifying which parameter will have the highest peel strength. But using this method is also sometimes confusing especially if we get some outliers resulting to a big variance that impact the determination of the best setup.
In this paper, we will be using Fourier Transform Infrared Spectroscopy (FT-IR) method to determine the cure percentage by calculating reaction ratio of processed ACF. The accuracy of this method will then be verified by comparing the result between FT-IR, DSC, and also correlated with the peel strength of connected ACF. The output of our studies will be use as a guideline on how to determine the % cure of the assembled ACF.
ACF (Anisotropic Conductive Film), FPC (Flexible Printed Circuit), FT-IR (Fourier Transform Infrared Spectroscopy), DSC (Differential Scanning Calorimetry), cure percentage, function group, peel strength
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