SMTA International Conference Proceedings


Fracture Toughness of Thermally Conductive Adhesives

Authors: John Timmerman, Ph.D., Maria Salamon
Company: Henkel
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques. Specifically, they use less material and space and are more amenable to automation than existing solutions. The thermal and mechanical properties of these materials are well understood but little work has been done to characterize and understand their toughness and fracture behavior. This paper presents the effects of filler loading as well as matrix composition on the fracture toughness of thermally conductive silicone adhesives. It was observed that the fracture toughness of these materials increased significantly with initial filler loading, and that the mechanical properties and fracture toughness depended on the molecular architecture of the matrix used.

Key Words: 

Thermal management, fracture toughness, adhesives



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