SMTA International Conference Proceedings

Micro-Dispensed 50 Micron Solder Dots from Type VII Solder

Authors: Sam LeBlanc, Joseph Conenna, Brandon Dickerson, Ken Church
Company: nScrypt, Inc.
Date Published: 9/17/2017   Conference: SMTA International

Abstract: As electronic packages become denser and the surfacemount component packages continue to shrink, there is an increasing challenge to solder to these devices. Precision robotic placement and decreased line widths are continuing to advance and the need for solder and micro dispensing to keep pace is critical. We present a study on using type VII solder with a micro-dispenser to print consistent 50-micron solder dots. A demonstration of the dispensing of 50-micron solder dots is presented with initial studies on reliability.

Key Words: 

Micro-dispensing, solder dispensing, 50- micron solder dot, printed electronics

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