SMTA International Conference Proceedings


The Mechanism of Nickel Corrosion in ENEPIG Deposits And How to Mitigate it

Authors: George Milad, Jon Bengston, Don Gudeczauskas
Company: Uyemura International Corporation
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Nickel corrosion in ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) deposits has been reported in multiple occasions. This was originally observed in cases where the desired gold thickness was in excess of 2.0 µins (0.05 µm). The boards were left in the gold bath for an extended dwell time until the desired gold thickness was achieved. In those cases, the gold ion reaches through micro-pores, that are common in thinner palladium deposits, below the palladium substrate to the underlying nickel and continues to deposit, corroding the nickel. This paper is an attempt to reproduce the defect, and to determine the necessary mitigation action to avoid nickel corrosion in the ENEPIG finish.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819