Solder Ball Joint Reliability with Electroless Ni/Pd/Au Plating -Influence of Phosphorus Content and Thickness of Electroless Pd Plating FilmAuthors: Yoshinori Ejiri, Takehisa Sakurai, Yoshinori Arayama, Yoshiaki Tsubomatsu, Kiyoshi Hasegawa
Company: Hitachi Chemical Co., Ltd.
Date Published: 9/17/2017 Conference: SMTA International
Our results show that SJR of ENEPIG tends to be poorer on the condition of the higher phosphorus content and the thicker electroless Pd. We conclude that pure Pd plating has the widest thickness range, and that the optimum thickness of the pure Pd plating film is 0.05~0.2 µm. On the other hand, the high phosphorus content and thick Pd-P films extremely lower SJR of ENEPIG. We found that the structure of IMCs changed from dendrite type to dome type with the increase of P content in electroless Pd plating. Consequently, we inferred that the high adhesion at the dendrite type IMC/solder interface resulted in excellent solder-ball joint reliability after the reflow cycles.
Electroless Ni/Pd/Au, Solder joint reliability, Intermetallic compounds (IMCs), Reflow cycles, Thermal aging, High-speed solder-ball shear test
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