SMTA International Conference Proceedings


Assembly Reliability of FPBG/FCBGA on HASL/ENEPIG

Authors: Reza Ghaffarian, Ph.D.
Company: Jet Propulsion Laboratory, California Institute of Technology
Date Published: 9/17/2017   Conference: SMTA International


Abstract: This paper presents the reliability of fine pitch plastic ball grid arrays (FPBGAs) with 228 (0.5-pitch) or 432 balls (0.4- mm pitch) with either tin-lead or SAC305 balls as well as the reliability of a flip-chip ball grid array (FCBGA) with 1924 tin-lead balls and 1-mm pitch— all assembled with eutectic tin-lead solder onto printed circuit boards (PCBs). Surface finishes for PCBs were electroless nickel electroless palladium immersion gold (ENEPIG) and tin-lead hot air solder level (HASL). These assemblies were subject to 200 thermal shock cycles (TSC, –65°C to 150°C). The TSC test results presented include daisy-chain resistances, SEM/Xsection images, and dye and pry destructive failure analyses for HASL and ENEPIG surface finishes.

Key Words: 

ENEPIG, HASL, solder joint reliability, FCBGA, flip chip BGA, fine pitch BGA, FPBGA, thermal shock cycle



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