Comprehensive Study of Various Short Failures on Printed Circuited BoardAuthors: Xiao He, Baojun Qiu, Daojun Luo
Company: Reliability Research and Analysis Center (RAC), China Electronic Product Reliability and Environmental Testing Institute
Date Published: 9/17/2017 Conference: SMTA International
In the present study, the various short failures had been summarized and classified into four typical categories: (1) quality defects of PCB; (2) foreign conductive metal residues on PCB; (3) electrochemical migration (ECM, conductive anodic filament (CAF) is regarded as one type of ECM) (4) ionic residues. The fault features, analysis methods, failure mechanisms and preventive measures were discussed through comprehensive analysis on the real short failure cases of each type.
It is suggested identifying fault features first, which is helpful to choose proper analysis methods, then find out root failure causes accurately, and put preventive measures specifically from electronic auxiliary materials controlling, PCB quality controlling, PCB layout design or electronic assembly management.
Reliability, Conductive Anodic Filament (CAF), Short Failure, Failure Analysis, Electrochemical Migration (ECM)
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