SMTA International Conference Proceedings

Comprehensive Study of Various Short Failures on Printed Circuited Board

Authors: Xiao He, Baojun Qiu, Daojun Luo
Company: Reliability Research and Analysis Center (RAC), China Electronic Product Reliability and Environmental Testing Institute
Date Published: 9/17/2017   Conference: SMTA International

Abstract: Electrical interconnection, mechanical support and electrical insulation are basic function requirements for printed circuit boards (PCB) in all of electronic products. The current trend toward miniaturization in electronics industry has forced a continuous reduction on conductor spacing. This fact has brought a greater reliability challenge to insulating properties of PCB. Short failure had become one of the most common PCB problems in field.

In the present study, the various short failures had been summarized and classified into four typical categories: (1) quality defects of PCB; (2) foreign conductive metal residues on PCB; (3) electrochemical migration (ECM, conductive anodic filament (CAF) is regarded as one type of ECM) (4) ionic residues. The fault features, analysis methods, failure mechanisms and preventive measures were discussed through comprehensive analysis on the real short failure cases of each type.

It is suggested identifying fault features first, which is helpful to choose proper analysis methods, then find out root failure causes accurately, and put preventive measures specifically from electronic auxiliary materials controlling, PCB quality controlling, PCB layout design or electronic assembly management.

Key Words: 

Reliability, Conductive Anodic Filament (CAF), Short Failure, Failure Analysis, Electrochemical Migration (ECM)

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