SMTA International Conference Proceedings

Achieving a Successful ENIG Finished PCB Under Revision a Of IPC 4552 Macdermid Enthone

Authors: Martin Bunce, Lenora Clark, John Swanson
Company: MacDermid Enthone
Date Published: 9/17/2017   Conference: SMTA International

Abstract: The 4-14 IPC Standards Committee recently created a revision to the IPC4552 specification for Electroless Nickel/Immersion Gold (ENIG) finished Printed Circuit Boards (PCB). Revision A brings a more comprehensive evaluation of metal layer thicknesses measurement, composition and introduces, for the first time, a quality aspect for nickel corrosion which has been historically connected to a defect called black line nickel or black pad. The introduction of these revisions will ensure a higher level of quality for conforming ENIG deposits but it will also present some challenges in achieving and consistently delivering the required level of quality from PCB fabrication.

IPC4552 Revision A requires that the PCB fabricator demonstrate capability in measuring and maintaining electroless nickel thickness and composition. The reduced minimum gold thickness and newly introduced maximum gold thickness specifications challenge not only measurement systems but also process control to comply with statistical restrictions on conforming ENIG product. The PCB Fabricator will also have new responsibility to establish control of the electroless nickel corrosion levels within given acceptability guidelines.

Key Words: 

IPC4552, ENIG, deposit thickness, electroless nickel composition, electroless nickel corrosion.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819