Achieving a Successful ENIG Finished PCB Under Revision a Of IPC 4552 Macdermid EnthoneAuthors: Martin Bunce, Lenora Clark, John Swanson
Company: MacDermid Enthone
Date Published: 9/17/2017 Conference: SMTA International
IPC4552 Revision A requires that the PCB fabricator demonstrate capability in measuring and maintaining electroless nickel thickness and composition. The reduced minimum gold thickness and newly introduced maximum gold thickness specifications challenge not only measurement systems but also process control to comply with statistical restrictions on conforming ENIG product. The PCB Fabricator will also have new responsibility to establish control of the electroless nickel corrosion levels within given acceptability guidelines.
IPC4552, ENIG, deposit thickness, electroless nickel composition, electroless nickel corrosion.
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