Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Hierarchy in SMT AssemblyAuthors: Sathish Kumar, Nicholas Herrick, Ranjit Pandher, Morgana Ribas, Amit Patel, Gyan Dutt, Ravi Bhatkal
Company: Alpha Assembly Solutions, a MacDermid Performance Solutions Business
Date Published: 9/17/2017 Conference: SMTA International
In this study we present process and reliability data for a new off-eutectic alloy with melting point range (192- 203°C). This alloy has the potential to fill a key gap in the alloy choices for Level 2 applications for LED, computer, server, and telecommunications applications. This solder alloy, being significantly different from the conventional lead-free solders, necessitates a completely different flux chemistry. Solder material properties and the solder paste processing through SMT assembly is discussed in detail. The alloy reliability (drop-shock and thermal cycling) was benchmarked against traditional Pb-free solders currently in the market.
Apart from traditional SMT assembly, alloy functional performance in LED applications was also investigated. Detailed results of thermo-mechanical reliability tests of the solder as well as the impact of flux chemistry on the LED performance over time are presented.
Pb-free Solders, Solder Hierarchy, LED, Die attach, SMT.
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