Laser Exfoliation Removal of Conformal Coatings from CCA PCB Pad SurfacesAuthors: Norman J. Armendariz, Ph.D., Cristian Porneala, Ph.D.
Company: Raytheon Co., IPG Photonics Corp.
Date Published: 9/17/2017 Conference: SMTA International
However, certain areas of the CCA or PCB-printed circuit board metallized surfaces are desired to be free of conformal coating and are required to be clean, solderable and electrically / thermally conductive.
Current conformal coating de-masking processes are time consuming and labor intensive. A more cost effective and automated laser-aided exfoliation method was evaluated and successfully demonstrated to remove parylene C conformal coatings from ENIG-plated Cu pads.
The parylene was removed within a precise pad area, and tested to be solderable to enable subsequent wire-soldering and consistent sealant coverage in a cost-effective manner. This paper will discuss the “physics” of laser ablation, laser exfoliation, materials interactions, test and characterization methods used to evaluate and validate the laser-aided removal processes on actual production CCA product.
Laser Exfoliation, Laser Ablation, Conformal Coating, SMT, PCB, CCA, Parylene, ENIG
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