SMTA International Conference Proceedings


PCBA Component Cleanliness Specifications Limits are Lacking

Authors: Mark Northrup, Joe Russeau, Don Tyler, Timothy A. Estes
Company: IEC Electronics, Precision Analytical Laboratory, Inc., Corfin Industries, Conductor Analysis Technologies, Inc.
Date Published: 9/17/2017   Conference: SMTA International


Abstract: Phase I of our testing had a goal to correlate IPC Chemical and Electrical CAF PCB test results. The electrical testing utilized for the test coupons was found within the PCQR2 Database document. The chemical testing of the coupons utilized Ion Chromatography (IC) testing in accordance with IPC-TM-650, method 2.3.28. Phase II of our testing focuses on Component Cleanliness utilizing referencing GEIASTD- 0006 in conjunction with chemical testing of the components via Ion Chromatography (IC) testing utilizing a hybrid approach via IPC-TM-650, method 2.3.28 with modifications. Phase III will target Printed Circuit Board Cleanliness and applying IPC-TM-650, method 2.3.28 to stage for our final phase. Phase IV application of Cleanliness Reliability Limits. In this Phase, our team intends on spurring industry focus to initiate as well as identify key ions of concern as well as ionic limits for high reliability electronics. The goal of this study was to correlate IPC Chemical and Electrical test results. The electrical testing utilized for the test coupons was found within the PCQR2 Database document. The chemical testing of the coupons utilized Ion Chromatography (IC) testing in accordance with IPC-TM-650, method 2.3.28.



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