Fill The Void IIIAuthor: Tony Lentz
Company: FCT Assembly
Date Published: 9/17/2017 Conference: SMTA International
The following variables were evaluated with respect to voiding: • Solder powder size was varied using a no-clean lead-free solder paste and IPC Type 3, Type 4 and Type 5 SAC305 solder powders. • Solder alloy was studied using SAC305 alloy, SN100C® alloy, SN100CV® alloy and a mixture of SAC305/SN100C alloys. • Surface finish on the circuit board is thought to have an impact on voiding. OSP surface finish is more difficult to wet with solder than other surface finishes and in theory should produce higher voiding levels, and this was evaluated with multiple solder pastes. • The performance of a new “low voiding” no clean solder paste was compared to other industry standard no clean solder pastes. • Several new stencil designs on QFN thermal pads were tested.
These voiding results were summarized along with previous data on voiding and recommendations given to help the reader “Fill the Void.”
voids, solder joint, solder paste, solder powder size, solder alloy, surface finish, stencil design, QFN
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