Effect of Voids on Thermo-Mechanical Reliability of Solder Joints
Authors: Morgana Ribas, Ph.D., Siuli Sarkar, Ph.D., Carl Bilgrien, Ph.D., Tom Hunsinger Company: Alpha Assembly Solutions, MacDermid Performance Solutions Alpha India R&D Centre Date Published: 9/17/2017
Abstract: Despite being a continuous subject of discussion, the existence of voids and their effect on solder joint reliability has always been controversial. In this work we revisit previous works on the various types of voids, their origins and their effect on thermo-mechanical properties of solder joints. We focus on macro voids, intermetallics micro voids, and shrinkage voids, which result from solder paste and alloy characteristics. We compare results from the literature to our own experimental data, and use fatigue-crack initiation and propagation theory to support our findings. Through a series of examples, we show that size and location of macro voids are not the primary factor affecting solder joint mechanical and thermal fatigue life. Indeed, we observe that when these voids area conforms to the IPC-A- 610 (D or F) or IPC-7095A standards, macro voids do not have any significant effect on thermal cycling or drop shock performance.
voids, crack initiation and growth, thermomechanical reliability, lead-free.