SMTA International Conference Proceedings


Reliability Study of Doped Lead Free Solder Paste Alloys by Thermal Cycling Testing

Authors: Sharath Sridhar, Anto Raj, John Evans, Ph.D., Michael Bozack, Ph.D., Wayne Johnson, Ph.D., Sa’d Hamasha, Ph.D.
Company: Department of Industrial & Systems Engineering at Auburn University, Department of Physics at Auburn University, Department of Electrical & Computer Engineering at Tennessee Tech University
Date Published: 9/17/2017   Conference: SMTA International


Abstract: This study was carried out to investigate the reliability performance of different electronic assemblies during thermal cycling testing. Various doped low creep lead-free solder alloys designed for high-temperature reliability have been used. The test boards used are 0.200" thick power computing printed circuit boards with MEGTRON6 as substrate material and OSP coating. Single-sided assemblies were built separately for the Top-side and Bottom-side of the boards. JEDEC JESD22-A104-B test standard was followed, the test boards were subjected to thermal cycling between the temperatures -400C and +1250C respectively and 120-minute cycle profile with 45-minute transitions and 15-minute dwells at peak temperatures. The test assemblies include surface mount resistors, 5mm, 6mm, 13mm, 15mm, 17mm, 31mm, 35mm and 45mm ball grid array packages respectively. The failure data of 15mm CABGA208 and 17mm CABGA256 are used in this study to understand the effect of solder paste composition on the solder joint reliability during thermal cycling testing.

Key Words: 

BGA, Lead-free, Reliability, Isothermal Aging, Flip Chip, Doping, Weibull Analysis



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